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ENIG 2U Motor Driver 10 Layer PCB Assembly Printed Circuit Board IATF 16949

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ENIG 2U Motor Driver 10 Layer PCB Assembly Printed Circuit Board IATF 16949

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Brand Name : WITGAIN PCB

Model Number : 10LayerPCB0032

Certification : UL

Place of Origin : China

MOQ : 1pcs/lot

Price : negotiable

Payment Terms : T/T

Supply Ability : 100kpcs/Moth

Delivery Time : 20 days

Packaging Details : Vacuum package in bubble wrap

Board Thickness : 2.0MM

Application : Motors

Solder Mask : Green Solder Mask

Surface Treatment : ENIG 2U'

Material : FR4

TG Degree : TG180

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DC Motor Control PCB Assembly 10 Layer Printed Circuit Board IATF 16949

Material Data Sheet:

S1000-2
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC ℃ 180
IPC-TM-650 2.4.24.4 DMA ℃ 185
Td IPC-TM-650 2.4.24.6 5% wt. loss ℃ 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 20
T300 IPC-TM-650 2.4.24.1 TMA min 5
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ 7.9 x 107
E-24/125 MΩ 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz -- —
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.013
IEC 61189-2-721 10GHz -- —
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm —
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

Most PCB companies classify vias with a diameter less than 150 microns to be microvias. These vias lower the possibility of any type of manufacturing defect since they are drilled using lasers which mitigates the chances of any residue left after the process. Because of their small size and ability to connect one layer to the next they enable denser printed circuit boards with more complex designs. Most HDI printed circuit boards use microvias.

Microvias are used to connect one layer of the board to its adjacent layer and have a very small diameter in comparison to the mechanically drilled vias such as PTH (Plated Through Hole).

Microvias are of two types, Stacked and Staggered.

ENIG 2U Motor Driver 10 Layer PCB Assembly Printed Circuit Board IATF 16949


Product Tags:

ENIG 2U 10 Layer PCB

      

10 Layer PCB Assembly

      

IATF 16949 Motor Driver PCB

      
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